Display device and method of fabricating the same

ABSTRACT

A display device includes first and second substrates each including a short side and a long side, ground parts located on at least one of the short and long sides of each of the first and second substrates and including at least one first ground surfaces, which are perpendicular to opposing surfaces of the first and second substrates, and at least one second ground surfaces, which are provided at at least one edge of the second substrate to define an obtuse angle with reference to the first ground surfaces, and unevenness disposed on the first ground surfaces along a first direction, where the unevenness defines an acute angle with reference to a normal line to the opposing surfaces.

This application is a continuation of U.S. patent application Ser. No.17/750,509, filed on May 23, 2022, which is a continuation of U.S.patent application Ser. No. 17/208,372, filed on Mar. 22, 2021, which isa is a continuation of U.S. patent application Ser. No. 16/775,002,filed on Jan. 28, 2020, which is a divisional of U.S. patent applicationSer. No. 15/584,975, filed on May 2, 2017, which claims priority toKorean Patent Application No. 10-2016-0054763, filed on May 3, 2016, andall the benefits accruing therefrom under 35 U.S.C. § 119, the contentof which in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention relate to a display device.

2. Description of the Related Art

A display device is classified into a liquid crystal display (“LCD”), anorganic light-emitting diode (“OLED”) display, a plasma display panel(“PDP”), an electrophoretic display, or the like according to how itemits light.

The display device generally includes a display panel for displaying animage. The display panel is provided by bonding upper and lowersubstrates having elements formed thereon for displaying an image so asto form a mother panel and then by cutting the mother panel to a desiredcell size. The cutting of the mother panel may be performed by definingcutting grooves by a cutting wheel and by hitting the mother panel alongthe cutting grooves with a breaker.

However, in a process of separating the display panel of the desiredsize from the mother panel through the aforementioned cutting procedure,horizontal or vertical cracks may be generated on cut surfaces of themother panel, and flaws such as plastic deformation may occur along thecutting grooves of the mother panel.

In order to remove or prevent any cracks or flaws in the mother panel, amethod of cutting the mother panel by a cutting wheel having a shallowcut-in depth has been suggested. Also, in order to remove any cracks orflaws in the mother panel, a method of grinding the cut surfaces of themother panel with a rough stone having a large granularity and a highhardness such as diamond may be used to remove cracks resulting from acutting process.

SUMMARY

There is a clear limit in healing cracks with a method of cutting amother panel by a cutting wheel having a shallow cut-in depth. Inaddition, a grinding method may increase a surface roughness of themother panel and lower strength of the mother panel.

Exemplary embodiments of the invention provide a display device capableof preventing cracks on the sides of a panel.

Exemplary embodiments of the invention also provide a method offabricating display device, which is capable of preventing cracks on thesides of a panel and involves grinding the panel so as to improve thestrength of the panel.

However, exemplary embodiments of the invention are not restricted tothose set forth herein. The above and other exemplary embodiments of theinvention will become more apparent to one of ordinary skill in the artto which the invention pertains by referencing the detailed descriptionof the invention given below.

According to an exemplary embodiment of the invention, a display deviceincludes first and second substrates each including a short side and along side, ground parts located on at least one of the sides of each ofthe first and second substrates and including at least one first groundsurfaces, which are perpendicular to opposing surfaces of the first andsecond substrates, and at least one second ground surfaces, which areprovided at at least one edge of the second substrate to define anobtuse angle with reference to the first ground surfaces, and unevennessdisposed on the first ground surfaces along a first direction, where theunevenness defines an acute angle with reference to a normal line to theopposing surfaces.

In an exemplary embodiment, at least one of the short side and the longside may have curvature.

In an exemplary embodiment, the ground parts further include at leastone second ground surfaces, which are provided at at least one edge ofthe first substrate to define an obtuse angle with reference to thefirst ground surfaces.

In an exemplary embodiment, the display device may further include acircuit board connected to the first or second substrate.

In an exemplary embodiment, the ground parts include the second groundsurfaces at an edge of the second substrate facing the circuit board,but do not include any second ground surfaces at an edge of the firstsubstrate facing the circuit board.

In an exemplary embodiment, the ground parts do not include any secondground surfaces at edges of the first and second substrates opposite tothe edges of the first and second substrates facing the circuit board.

In an exemplary embodiment, the acute angle may be about 30° to about80°.

In an exemplary embodiment, the unevenness may have a center lineaverage roughness Ra of about 300 nm or less.

In an exemplary embodiment, the first or second substrate may include asealing member, which is placed in contact with the first and secondsubstrates.

According to an exemplary embodiment of the invention, a method offabricating a display device includes providing a mother panel bybonding a second substrate onto a first substrate, separating a panel bycutting the mother panel along boundaries of a cell, allowing the panelto enter a grinder including a grinding part, which includes a grindingsurface, and a shaft, which is connected to the grinding part, andgrinding at least one cut surface of the panel by placing the at leastone cut surface of the panel in contact with the grinder that isrotating, where a plane perpendicular to a rotation axis of the grinderdefines a right angle with reference to opposing surfaces of the firstand second substrates.

In an exemplary embodiment, the method may further include grinding thepanel by placing at least one edge of the first substrate in contactwith the grinding surface.

In an exemplary embodiment, the method may further include grinding thepanel by placing at least one edge of the second substrate in contactwith the grinding surface.

In an exemplary embodiment, during the grinding the panel, the rotationaxis of the grinder may not fall on the same plane as those of theopposing surfaces.

In an exemplary embodiment, a diameter of the grinding part may besmaller than a length of sides of the panel.

In an exemplary embodiment, the method may further include bonding thefirst and second substrates by applying a sealant onto the first orsecond substrate.

According to the aforementioned and other exemplary embodiments of theinvention, defects such as cracks that may be generated on the sides ofa panel can be prevented, and the strength of the panel can be improvedby uniformly and efficiently grinding the sides of the panel.

Other features and exemplary embodiments may be apparent from thefollowing detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary embodiments and features of the inventionwill become more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings, in which:

FIG. 1 is a perspective view illustrating an exemplary embodiment of thegrinding of a side surface of a panel according to the invention;

FIG. 2 is a perspective view illustrating an exemplary embodiment of agrinder according to the invention;

FIG. 3A is a side view of the panel of FIG. 1 as viewed from a directionA of FIG. 1 ;

FIG. 3B is a side view of the panel of FIG. 1 as viewed from a directionB of FIG. 1 ;

FIG. 3C is a side view of the panel of FIG. 1 as viewed from a directionC of FIG. 1 ;

FIG. 4 is an enlarged perspective view of an area D of FIG. 1 ;

FIGS. 5A through 5D are views illustrating an exemplary embodiment of amethod of fabricating a display device according to the invention; and

FIGS. 6A and 6B are side views illustrating an exemplary embodiment of agrinding process according to the invention.

DETAILED DESCRIPTION

Advantages and features of the invention and methods of accomplishingthe same may be understood more readily by reference to the followingdetailed description of exemplary embodiments and the accompanyingdrawings. The invention may, however, be embodied in many differentforms and should not be construed as being limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this invention will be thorough and complete and willfully convey the concept of the invention to those skilled in the art,and the invention will only be defined within the scope of the appendedclaims.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper”, and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the drawings. It will be understood thatthe spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the drawings. For example, if the device in thedrawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. The device may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein interpreted accordingly.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. Also, the terms“comprises,” comprising,” “includes,” and/or “including,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, components, and/or groups thereof, but donot preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the invention. “About” or “approximately” as used herein isinclusive of the stated value and means within an acceptable range ofdeviation for the particular value as determined by one of ordinaryskill in the art, considering the measurement in question and the errorassociated with measurement of the particular quantity (i.e., thelimitations of the measurement system). For example, “about” can meanwithin one or more standard deviations, or within ±30%, 20%, 10%, 5% ofthe stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andthis specification and will not be interpreted in an idealized or overlyformal sense unless expressly so defined herein.

FIG. 1 is a perspective view illustrating the grinding of a side of apanel according to an exemplary embodiment of the invention, and FIG. 2is a perspective view illustrating a grinder according to an exemplaryembodiment of the invention.

Referring to FIG. 1 , a panel 100 of a cell unit is provided by cuttinga mother panel, which is obtained by bonding first and second substrates110 and 120 together, and a grinding process is performed by moving thepanel 100 over to a grinder 200, which is rotated at high speed about arotation axis AX (refer to FIG. 2 ).

In order to sufficiently grind the sides of the panel 100, the panel 100is moved at substantially low speed while rotating the grinder 200 atsubstantially high speed. The rotation speed of the grinder 200 and themoving speed of the panel 100 may be determined in consideration of anefficiency of grinding.

In a case where the rotation speed of the grinder 200 is about 1,000revolutions per minute (rpm) or lower, the sides of the panel 100 maynot be able to be sufficiently ground. In a case where the rotationspeed of the grinder 200 exceeds about 10,000 rpm, the panel 100 may notbe able to be uniformly ground because vibration is generated due to thehigh rotation speed of the grinder 200. Accordingly, in an exemplaryembodiment, the rotation speed of the grinder 200 may be determined tobe in the range of about 1,000 rpm to about 10,000 rpm, for example.

In an exemplary embodiment, the moving speed of the panel 100 may be inthe range of about 0.1 meter per minute (m/min) to about 10 m/min, forexample. In general, as the moving speed of the panel 100 decreases, thepanel 100 can be ground more sufficiently and uniformly. However, in acase where the moving speed of the panel 100 is lower than 0.1 m/min,the grinding of the panel 100 may not be able to be properly controlled,and the yield of the panel 100 may decrease. In a case where the movingspeed of the panel 100 exceeds about 10 m/min, the panel 100 may not beable to be sufficiently ground, and as a result, the efficiency ofgrinding the panel 100 may decrease, and defects may occur.

Given all the above, the rotation speed of the grinder 200 and themoving speed of the panel 100 may be determined in consideration of theefficiency and speed of grinding the panel 100.

Referring to FIG. 2 , the grinder 200 includes a grinding part 210 and ashaft 230.

The grinding part 210 includes a grinding surface 211, whichsubstantially performs a grinding process on a target object by directlycontacting the target object. The diameter of the grinding part 210 maybe smaller than the length of the sides of the panel 100.

The grinding part 210 is illustrated in FIG. 2 as including aring-shaped grinding surface 211, but the invention is not limitedthereto. That is, the grinding part 210 may include the grinding surface211, which may have various shapes.

Although not specifically illustrated, a cylindrical groove may bedefined in the center of the grinding part 210 of the grinder 200 toprevent an excessive load from being applied to the center of thegrinding part 210 during grinding.

The grinding surface 211 may include a material obtained by mixing thecombination of a healing agent and an abrasive with a binder.

In an exemplary embodiment, the binder may be polyurethane, for example.By using polyurethane as the binder, pores can be disposed on thegrinding surface 211, and as a result, a soft-material grinding surface211 can be obtained. Accordingly, in a case where the grinder 200includes diamond or the like, a problem in which a rough cross sectionis obtained after grinding due to the high hardness of the grinder 200can be addressed. In an exemplary embodiment, the binder includingpolyurethane may be included in an amount of, for example, about 30% byweight to about 50% by weight.

In an exemplary embodiment, cerium oxide (CeO₂) may be used as thehealing agent for preventing defects such as cracks in the targetobject, for example. In an exemplary embodiment, in order to improve thegrinding effect of the grinder 200, at least one of zirconium oxide(ZrO₂), silicon carbide (SiC), and aluminum oxide (Al₂O₃) may be used asthe abrasive, for example. In an exemplary embodiment, the combinationof the healing agent and the abrasive may include, for example, about50% to about 60% by weight of the healing agent, i.e., CeO₂. ZrO₂, SiC,and Al₂O₃, which can be also used as abrasives, may be added in anamount of about 10 wt % or more, respectively.

Accordingly, the grinding surface 211 may include pores and may thusexhibit soft-material properties. Also, the grinding surface 211 canprevent cracks and can improve the grinding effect of the grinder 200.

The shaft 230 transmits rotational force to the grinding part 210 sothat the grinding surface 211 can rotate at substantially high speed toperform grinding. Specifically, the shaft 230 is connected to anelectric motor (not illustrated), which is driven by an external powersource, and rotates at high speed to transmit rotational force to thegrinding part 210.

The rotation axis AX of the shaft 230 is not located on the same planeas those of opposing surfaces CP of the first and second substrates 110and 120 in order to prevent the panel 100 from being damaged by cracksafter being ground. Rather, the rotation axis AX of the shaft 230 isdisposed in parallel with the opposing surfaces CP. That is, a grindingprocess is performed by arranging the grinder 200 such that a targetside surface of the panel 100 to be ground can be placed in contact witha lower portion of the grinding part 210 that is below the rotation axisAX. Accordingly, unevenness is provided in ground parts of the panel100, which will be described later, along a first direction that is notperpendicular to the opposing surfaces CP. This will be described laterin detail.

FIG. 3A is a side view of the panel of FIG. 1 as viewed from a directionA of FIG. 1 , FIG. 3B is a side view of the panel of FIG. 1 as viewedfrom a direction B of FIG. 1 , and FIG. 3C is a side view of the panelof FIG. 1 as viewed from a direction C of FIG. 1 . FIG. 4 is an enlargedperspective view of an area D of FIG. 1 .

Referring to FIGS. 1 through 4 , the first and second substrates 110 and120 are bonded by a sealing member 130, but the invention is not limitedthereto. That is, in other exemplary embodiments, the first and secondsubstrates 110 and 120 may be bonded by various methods other than usingthe sealing member 130.

The panel 100 may include ground parts on its side surface (hereinafter,referred to as “the first side surface”) that can be viewed from thedirection A of FIG. 1 , its side surface (hereinafter, referred to as“the second side surface”) that can be viewed from the direction B ofFIG. 1 , and its side surface (hereinafter, referred to as “the thirdside surface”) that can be viewed from the direction C of FIG. 1 .Although not specifically illustrated, the first or second substrate 110or 120 of the panel 100 is connected to a circuit board for driving adisplay element.

Referring to FIG. 3A, the ground parts on the first side surface of thepanel 100 include first ground surfaces GP1, which are disposed on thefirst side surface of the panel 100.

The first side surface of the panel 100 is placed in contact with, andground by, the lower portion of the grinding part 210 that is below therotation axis AX of the grinder 200, and as a result, unevenness isprovided on the first ground surfaces GP1 along the first direction.

Specifically, referring to FIG. 4 , unevenness is provided on the firstground surfaces GP1 to define a predetermined angle β with reference toa normal line VL to the opposing surfaces CP of the first and secondsubstrates 110 and 120. That is, a straight line SL extending along thefirst direction defines an acute angle β with the normal line VL to theopposing surfaces CP. In an exemplary embodiment, the acute angle β maybe, for example, about 30° to about 80°, for example.

In an exemplary embodiment, the unevenness provided on the first groundsurfaces GP1 has a center line average roughness Ra of about 300 nm orless, for example. In an exemplary embodiment, the center line averageroughness Ra may be about 200 nanometers (nm) to about 300 nm.

Accordingly, the strength of the panel 100 can be improved, and damagethat may be caused to the panel 100 by defects such as cracks can beprevented. This is more apparent in a curved display device, which ishighly susceptible to damage that may be caused to the panel 100 bycracks.

Referring to FIG. 3B, the ground parts on the second side surface of thepanel 100 include first ground surfaces GP1 and a second ground surfaceGP2. A terminal part (not illustrated) of the panel 100 is connected tothe circuit board through the second side surface of the panel 100, anda flexible connector may be used to connect the terminal part to thecircuit board.

The first ground surfaces GP1 on the second side surface of the panel100, like the first ground surfaces GP1 on the first side surface of thepanel 100, have unevenness provided along the first direction.Accordingly, the strength of the panel 100 can be improved, and damagethat may be caused to the panel 100 by defects such as cracks can beprevented

The second ground surface GP2 is disposed on the second side surface ofthe panel 100 along an edge of the second substrate 120 and defines anobtuse angle α (refer to FIG. 3C) with the first ground surfaces GP1 onthe second side surface of the panel 100. In an exemplary embodiment,the obtuse angle α may be, for example, about 80° to about 170°, forexample.

Accordingly, the panel 100 can be prevented from being damaged by anycracks on the second side surface of the panel 100. Also, by providingthe second ground surface GP2 on the second side surface of the panel100, the flexible connector can be prevented from being damaged by asharp edge of the panel 100.

The second ground surface GP2 is illustrated in FIG. 3B as beingdisposed only on a side surface of the second substrate 120corresponding to the second side surface of the panel 100, but theinvention is not limited thereto. That is, in an alternative exemplaryembodiment, the second ground surface GP2 may also be provided on a sidesurface of the first substrate 110 corresponding to the second sidesurface of the panel 100.

Referring to FIG. 3C, the ground parts of the third side surface of thepanel 100 include second ground surfaces GP2, which are provided onedges of the first and second substrates 110 and 120.

Accordingly, the panel 100 can be prevented from being damaged by anycracks on the third side surface of the panel 100.

A display device according to an exemplary embodiment of the inventionand a method of fabricating a display device according to an exemplaryembodiment of the invention will hereinafter be described with referenceto FIGS. 5A through 5D. FIGS. 5A through 5D are views illustrating amethod of fabricating a display device according to an exemplaryembodiment of the invention. In the description that follows, it isassumed that the display device according to the illustrated exemplaryembodiment is a liquid crystal display (“LCD”).

The display device according to the illustrated exemplary embodimentincludes the first substrate 110 on which a thin-film transistor (“TFT”)is disposed, the second substrate 120 on which a color filter (“CF”) isdisposed, and a liquid crystal layer (not illustrated) which isinterposed between the first and second substrates 110 and 120. In anexemplary embodiment, the CF may be disposed on the first substrate 110.However, the invention is not limited thereto, and the CF may bedisposed on the second substrate 120.

FIG. 5A illustrates a part of a display region of the first and secondsubstrates 110 and 120. Referring to FIG. 5A, a gate electrode 111 isdisposed on the first substrate 110. In an exemplary embodiment, thefirst substrate 110 may be a transparent insulating substrate includingglass, and the gate electrode 111 is provided by patterning a metallayer, for example.

A gate insulating film 112, a semiconductor layer 113, and an ohmiccontact layer 114 are sequentially disposed on the first substrate 110and on the gate electrode 111. In an exemplary embodiment, the gateinsulating film 112 may include an inorganic insulating material such assilicon nitride (SiNx) or silicon oxide (SiO₂). The semiconductor layer113 and the ohmic contact layer 114 may both have a stack structure.

A source electrode 115 and a drain electrode 116 are disposed on theohmic contact layer 114, and a passivation film 117 is disposed on thesource electrode 115 and on the drain electrode 116. Each of the sourceelectrode 115 and the drain electrode 116 is provided by patterning ametal layer. In an exemplary embodiment, the passivation film 117 mayinclude an inorganic insulating material such as SiNx or SiO₂ or anorganic insulating material such as an acrylic resin or benzocyclobutene(“BCB”).

Thereafter, the passivation film 117 is etched to expose the drainelectrode 116, and a conductive layer on the passivation film 117 ispatterned, thereby providing a pixel electrode 118 to be in contact withthe drain electrode 116.

The CF (not illustrated) and a common electrode 121, which is forapplying a voltage to the second substrate 120, are disposed on thesecond substrate 120. In an exemplary embodiment, the second substrate120 may be a transparent insulating substrate including glass, forexample. In an exemplary embodiment, the common electrode 121 mayinclude a transparent conductive material such as indium tin oxide(“ITO”) or indium zinc oxide (“IZO”), for example. In an exemplaryembodiment, the ITO may be a polycrystalline or monocrystallinematerial, and the IZO may also be a polycrystalline or monocrystallinematerial, for example.

Although not specifically illustrated, each of the first and secondsubstrates 110 and 120 may include a light-blocking part, which includesa black pigment.

After the preparation of the first and second substrates 110 and 120, asealant is applied on a non-display region on the outside of the displayregion of the second substrate 120, and the first and second substrates110 and 120 are bonded together to provide a mother panel. Thereafter, asealing member 130 is provided by curing the sealant through ultraviolet(“UV”) exposure, and a liquid crystal material is injected between thefirst and second substrates 110 and 120.

The above-mentioned structure of the panel 100 is merely exemplary, andthe invention is not limited thereto. That is, the invention is alsoapplicable to various types of panels other than that set forth herein.Also, the panel 100 has been described to include an LCD panel as anexample, but the invention is not limited to an LCD panel. That is, thepanel 100 may also be applicable to various other types of the displaydevice such as an organic light-emitting diode (“OLED”) panel.

Referring to FIG. 5B, cutting grooves are defined in the mother panelalong the boundaries of a cell using a cutting wheel 300, and the panel100 (refer to FIG. 1 ) is separated by hitting the mother panel alongthe cutting grooves. The cutting grooves may be defined in at least oneof the first and second substrates 110 and 120. The sealing member 130may be provided near the boundaries of the cell, but may also beprovided to overlap with the boundaries of the cell to extend over to aneighboring cell, in which case, the separation of the panel 100 fromthe mother panel is performed by cutting the top of the sealing member130 to define cutting grooves and hitting the mother panel along thecutting grooves.

A large number of defects such as cracks may be provided on the edges ofthe panel 100 after the hitting of the mother panel along the cuttinggrooves to separate the panel 100. Since the separation of the panel 100is performed by defining cutting grooves on the first and secondsubstrates 110 and 120 with the cutting wheel 300 and hitting the firstand second substrates 110 and 120 along the cutting grooves, inner edgesof the first and second substrates 110 and 120 that are not in contactwith the cutting wheel 300 may become substantially perpendicular to thetop and bottom surfaces of the panel 100. Accordingly, defects such ascracks are not provided on the inner edges of the cut surfaces of thefirst and second substrates 110 and 120, and as a result, an additionalgrinding process is not performed.

A grinding process is needed for the outer edges of the cut surfaces ofthe first and second substrates 110 and 120 to remove defects such ascracks and to improve rigidity. Thus, after the cutting of the motherpanel to separate the panel 100, the outer edges of the cut surfaces ofthe first and second substrates 110 and 120 are ground using the grinder200. Specifically, outer edges of the cut surfaces of the first andsecond substrates 110 and 120 that are highly susceptible to defectssuch as cracks, for example, one to eight outer edges, can beselectively ground. In the illustrated exemplary embodiment, all theouter edges of the cut surfaces of the first and second substrates 110and 120 except for those on the first side surface of the panel 100,i.e., a total of six outer edges, may be ground.

The outer edges of each of the first and second substrates 110 and 120may be ground at the same time. That is, by using multiple grinders 200disposed above or below the panel 100, the edges of each of the firstand second substrates 110 and 120 may be ground at the same time, butthe invention is not limited thereto. That is, various methods may beused to grind the edges of the panel 100 depending on the size of thepanel 100 and other grinding conditions.

Referring to FIGS. 5C and 5D, which illustrate the grinding of the firstside surface of the panel 100, the first side surface of the panel 100may be ground in a direction perpendicular to the opposing surfaces CPof the first and second substrates 110 and 120 using the grinder 200,instead of grinding the edges of the cut surfaces of the first andsecond substrates 110 and 120. That is, first ground surfaces GP1 areprovided on the first side surface of the panel 100 along the directionperpendicular to the opposing surfaces CP of the first and secondsubstrates 110 and 120. The grinder 200 of FIGS. 1 through 4 is used toprovide the first ground surfaces GP1.

The first side surface of the panel 100 is placed in contact with, andground by, the lower portion of the grinding part 210 that is below therotation axis AX of the grinder 200, and as a result, unevenness isprovided on the first ground surfaces GP1 along the first direction.

Specifically, unevenness is provided on the first ground surfaces GP1 todefine a predetermined angle β with reference to a normal line VL to theopposing surfaces CP of the first and second substrates 110 and 120.That is, a straight line SL extending along the first direction definesan acute angle β with the normal line VL to the opposing surfaces CP. Inan exemplary embodiment, the acute angle β may be, for example, about30° to about 80°, for example.

In an exemplary embodiment, the unevenness provided on the first groundsurfaces GP1 has a center line average roughness Ra of about 300 nm orless, for example. In an exemplary embodiment, the center line averageroughness Ra may be about 200 nm to about 300 nm, for example.

As mentioned above, the panel 100 is ground using the grinder 200 and iscoupled to a circuit board, a backlight assembly, and a mold frameaccommodating the circuit board and the backlight assembly, therebyobtaining the display device according to the illustrated exemplaryembodiment.

The method of fabricating a display device according to the illustratedexemplary embodiment can remove defects such as cracks by grinding theside surfaces of the panel 100 with the grinder 200, and can improve thestrength of the panel 100 by providing unevenness on the panel 100 alongthe first direction.

In addition, a curved display device or a mid- or small-size displaydevice having a relatively thin panel is highly susceptible to defectssuch as cracks, and thus, its panel is highly likely to be damaged.These problems can be addressed by applying the panel 100.

FIGS. 6A and 6B are side views illustrating a grinding process accordingto an exemplary embodiment of the invention.

Specifically, FIGS. 6A and 6B illustrate the grinding of the second sidesurface of the panel 100. Referring to FIGS. 6A and 6B, edges of the cutsurfaces of the first and second substrates 110 and 120 on the secondside surface of the panel 100 are ground first.

Specifically, edges of the second side surfaces of the first and secondsubstrates 110 and 120 are ground to have different ground areas. Thatis, a ground width d1 at the top of the second substrate 120 may begreater than a ground width d2 at the bottom of the first substrate 110.In an exemplary embodiment, the ground width d1 may be about 400micrometers (um) to about 500 um, and the ground width d2 may be about80 um to about 150 um, for example.

The outer edges of each of the first and second substrates 110 and 120may be ground at the same time. That is, the edges of each of the firstand second substrates 110 and 120 may be simultaneously ground usingmultiple grinders 200 disposed above and below, respectively, the secondside surface of the panel 100, but the grinding of the panel 100 is notlimited thereto. That is, the grinding of the panel 100 may varydepending on the size of the panel 100 and other grinding conditions.

Edges of the cut surfaces of the first and second substrates 110 and 120are ground first, and then the second side surface of the panel 100 isground using the grinder 200 to be perpendicular to the opposingsurfaces CP of the first and second substrates 110 and 120. That is, afirst ground surface GP1 is provided on a part of the side surface ofthe second substrate 120 corresponding to the second side surface of thepanel 100 to be perpendicular to the opposing surfaces CP of the firstand second substrates 110 and 120. Also, the ground surface at thebottom edge of the first substrate 110 is removed, and another firstground surface GP1 (refer to FIGS. 3A and 3B) is provided on the entireside surface of the first substrate 110 corresponding to the second sidesurface of the panel 100 to be perpendicular to the opposing surfaces CPof the first and second substrates 110 and 120. The grinder 200 of FIGS.1 through 4 may be used to grind the second side surface of the panel100.

The ground surface at the bottom edge of the first substrate 110 may becompletely removed during the grinding of the second side surface of thepanel 100, but the invention is not limited thereto. That is, a secondground surface GP2 may be disposed on the bottom edge of the firstsubstrate 110 after the grinding of the second side surface of the panel100.

The second side surface of the panel 100 is ground by being placed incontact with the lower portion of the grinding part 210 that is belowthe rotation axis AX of the grinder 200, and as a result, unevenness isprovided on the first ground surfaces GP1 along the first direction.

The unevenness provided on the first ground surfaces GP1 defines apredetermined angle β with reference to a normal line VL (refer to FIG.4 ) to the opposing surfaces CP of the first and second substrates 110and 120. That is, a straight line SL (refer to FIG. 4 ) extending alongthe first direction defines an acute angle β with the normal line VL tothe opposing surfaces CP. In an exemplary embodiment, the acute angle βmay be, for example, about 30° to about 80°, for example.

In an exemplary embodiment, the unevenness provided on the first groundsurfaces GP1 has a center line average roughness Ra of about 300 nm orless, for example. In an exemplary embodiment, the center line averageroughness Ra may be about 200 nm to about 300 nm, for example.

The method of fabricating a display device according to the illustratedexemplary embodiment can remove defects such as cracks by grinding theside surfaces of the panel 100 with the grinder 200, and can improve thestrength of the panel 100 by providing unevenness on the panel 100 alongthe first direction.

In addition, a curved display device or a mid- or small-size displaydevice having a relatively thin panel is highly susceptible to defectssuch as cracks, and thus, its panel is highly likely to be damaged.These problems can be addressed by applying the panel 100.

While exemplary embodiments are described above, it is not intended thatthese embodiments describe all possible modifications of the invention.Rather, the words used in the specification are words of descriptionrather than limitation, and it is understood that various changes may bemade without departing from the spirit and scope of the invention.Additionally, the features of various implementing embodiments may becombined to provide further exemplary embodiments of the invention.

What is claimed is:
 1. A display device, comprising: first and secondsubstrates facing each other to define opposing surfaces, each of thefirst and second substrates including a first side surface and a secondside surface; and a ground part located on the first side surface of thefirst substrate or on the first side surface of the second substrate andincluding at least one first ground surface, which is perpendicular tothe opposing surfaces, wherein the at least one first ground surface hasa plurality of grooves, wherein each of the plurality of grooves issubstantially extended in a first direction which defines a first anglewith reference to a normal line to the opposing surfaces, and whereinthe first angle is an acute angle.